Shenzhen Hongyi Decheng Technology Co., Ltd



USB2.0 AF 90 degree SMT LCP white glue with column terminal semi-gold tin GF copper shell nickel plated SMT feet with curling

USB2.0 AF 90 degree SMT LCP white glue with column terminal semi-gold tin GF copper shell nickel plated SMT feet with curling

Electrical parameters

Electrical
Rating: 30V AC
Current: 1.5A
Withstanding Voltage: 500V AC
Contact Resistance: 30mΩ. MAX.
Insulation Resistance: 1000 MΩ. MIN.
Operating temperature: -40°C ~ +85°C;

Specifications

Specification(Abbreviation)
Family: Type A
Interface: Single
PCB Mounting: SMT
Operation Direction: R/A

Data download

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